Summit SOM 8M Plus System-on-Module - WiFi 5 + Bluetooth 5.3
i.MX 8M Plus with Dual-Band 2x2 Wi-Fi 5 + Bluetooth 5.3 System-on-Module
The Summit SOM 8M Plus, which is powered by NXP Semiconductor's i.MX 8M Plus processor and 88W8997 wireless SoC, is a versatile, power-efficient quad Cortex-A53 and Cortex-M7 solution for powerful heterogeneous multiprocessing, machine learning, rich multimedia (graphics, video, vision, and audio), advanced connectivity, and enhanced security to enable high-performance, flexible solutions.
Features:
- Wi-Fi 5 2x2 MU-MIMO
- Bluetooth 5.3
- 1.6 GHz quad-core Cortex-A53 MPU and 800 MHz Corex-M7 MCU
- Machine learning, graphics, video, vision, and audio – up to three displays
- Secure enclave and secure boot powered by i.MX 8M Plus
- Extensive range of pre-certified antennas
- 10+ year product lifecycle
- CVE remediated Long Term Support Linux
- Upcoming FIPS 140-3 Level 1 validation
- Industrial temperature rating
- Global certifications/registrations
Processors
- Microprocessor
- 4x Cortex®-A53 cores @ 1.6 GHz
- Microcontroller
- 1x Cortex®-M7 core @ 800 MHz
- Audio
- Tensilica® HiFi 4 DSP
- Graphics
- GC7000UL with 2 shaders for 3D and GC520L for 2D
- Machine Learning
- Neural Processing Unit (NPU) with 2.3 TOP/s
Memory
- RAM
- Up to 2GB LPDDR4 standard; Up to 6GB LPDDR4 on request
- Storage
- Up to 16GB eMMC 5.1 standard; Up to 64GB eMMC 5.1 on request
Machine Learning
- Neural Processing Unit
- Keyword detect, noise reduction, beamforming
- Speech recognition (i.e. Deep Speech 2)
- Image recognition (i.e. ResNet-50)
Graphics and Video
- Graphics Processing Unit
- 166 million triangles/sec
- 1.0 giga pixel/sec
- 16 GFLOPs 32-bit
- OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan
- 2D acceleration
Video Processing Unit
- Video Decode
- 1080p60 HEVC/H.265 Main, Main 10 (up to level 5.1)
- 1080p60 VP9 Profile 0, 2
- 1080p60 VP8
- 1080p60 AVC/H.264 Baseline, Main, High decoder
- Video Encode
- 1080p60 AVC/H.264 encoder
- 1080p60 HEVC/H.265 encoder
- Display Interfaces
- 1x MIPI DSI, up to UWHD and WUXGA
- 1x LVDS Tx, up to 1920x1080p60
- 1x HDMI 2.0a Tx, up to 4kp30
Vision
- Camera
- 2x 4-lane MIPI CSI
- Image Signal Processor
- 375 Mpixel/s HDR ISP supporting configurations, such as 12MP@30fps, 4kp45, or 2x 1080p80
Audio
- Audio Interfaces
- SPDIF input and output
- Six external SAI modules supporting I2S, AC97, TDM, codec/DSP, and DSD interfaces
- ASRC
- eARC/ARC (HDMI)
- 8-channel PDM mic input
Peripherals
- Input/Output
- 2x USB 3.0/2.0 Dual-Role with PHY
- 2x Gbit Ethernet with IEEE® 1588, AVB (One also supports TSN)
- 2x CAN/CAN FD
- 4x UART 5 Mbit/s
- 6x I2C
- 3x SPI
- 1x SDIO 3.0/eMMC 5.1
Wireless Specification
- Wi-Fi
- Wi-Fi 5 (802.11ac)
- Bluetooth®
- v5.3
- Frequency
- Dual-Band 2.4GHz & 5GHz
- Transmit Power
- + 18 dBm (maximum)
- Receive Sensitivity
- TBD
- Antenna Options
- 2x U.FL connectors for external antennas
- Raw Data Rates (Air)
- Wi-Fi 5 866.7Mbit/s - MCS9, 2 Spatial Streams, 80MHz, 256QAM, SGI
Key Wi-Fi Features
- Wi-Fi 5 (802.11ac)
- IEEE 802.11 a/b/g/n/ac
- 20, 40 & 80MHz bandwidth support
- MU-MIMO, OFDMA
- Transmit Beamforming
Key Bluetooth Features
- Bluetooth
- Classic Bluetooth – BR / EDR
- 2 x WideBand Speech (WBS) links
- Central / Peripheral Modes
- Up to 16 Bluetooth LE connections
- LE Secure Connections
- 2MPHY
Supply Voltage
- 3.3V
Power Consumption
- Estimated Current
- Continuous TX:
- 2.4 GHz band – TBD
- 5 GHz band – TBD
- Continuous TX:
Physical
- Dimensions
- 40mm x 47 mm x ?.? mm (SIP Modules)
Environmental
- Temp Range
- -30°C to +85°C
Miscellaneous
- Lead-Free
- Lead-free and RoHS-compliant
- Development Kit
- Development board, accessories, and evaluation software
Qualifications
- Bluetooth® SIG
- Bluetooth 5.3
Regulatory
- Approvals
- FCC/IC/CE/MIC/RCM