VTC6222-GCIoT - Google Cloud AI Edge In-Vehicle Solution

In stock
SKU
VTC6222-GCIoT - Google Cloud AI Edge In-Vehicle Solution
Brand: Nexcom

Intel AtomĀ® processor E3950 up to 2.0GHz CPU, 4GB DDR3L SODIMM, Google Edge TPU, DC input 9~48 VDC

Enquire Now
Enquire about this product:

·         Built-in Google Edge TPU ML accelerator coprocessor

·         Intel Atom® processor quad core E3950, up to 2.0GHz

·         4 x PoE (802.3af/at, max. 60W)

·         Built-in u-blox-M8N GPS

·         Built-in CAN Bus 2.0B

·         Three video outputs, one VGA and two HDMI

·         E Mark conformity

·         3 x mini-PCIe socket expansion

·         Dual external storage (compatible with 15mm disk)

·         1 x USB DOM to run OS

·         1 x SD card for exporting and backing up data

CPU
ĀŒIntelAtomĀ® processor quad core E3950, up to 2.0GHz, 12W, 4 core


Memory
ĀŒ1 x 204-pin DDR3L SO-DIMM socket support 1866MHz up to 8GB.
Default 4GB


Google Edge TPU (Coral ML Accelerator Card)
ĀŒHardware interface: mini-PCIe (half size)
ĀŒSerial interface: PCIe Gen2 x1
ĀŒPerformance: 4TOPS @2Watt
ĀŒOperating voltage: 3.3V +/- 10 %
ĀŒDimensions: 30mm x 26.8mm x 2.5 mm


Video Output
ĀŒChipset IntelĀ® HD graphics 505
ĀŒ2 x HDMI 1.4b up to 4096 x 2160 @30Hz
ĀŒ1 x VGA up to 1920 x 1200 @60Hz


Storage
ĀŒ2 x 2.5" SSD/HDD SATA 3.0 (compatible with 15mm drive)
ĀŒ1 x SD memory card 3.0 (externally accessible)
ĀŒ1x USB EDC for USB DOM


Expansion
ĀŒ1 x Full size mini-PCIe socket (USB 2.0), BOM optional M.2 Key B
(USB2.0 + USB 3.0) with 2 x external SIM
ĀŒ1 x Full size mini-PCIe socket (USB 2.0 + PCIe 2.0)
ĀŒ1 x Half size mini-PCIe socket (USB 2.0 + PCIe 2.0)


GNSS and On Board Sensor
ĀŒ1 x Default U-blox NEO-M8N GNSS for GPS/Glonass/QZSS/Galileo/
Beidou
ĀŒG Sensor (3-axis, 10-bit resolution)
ĀŒTPM 2.0 (optional)


LAN and Power over Ethernet
ĀŒ4-Port LAN, 10/100/1000 Mbps I210-IT GbE, PoE 802.3af/at, max. 60W
ĀŒ1-Port LAN, 10/100/1000 Mbps I210-IT GbE


I/O Interface-Front
ĀŒ12 x LED indicators (including 3 x programmable LED)
ĀŒ2 x Externally accessible SIM card socket with cover
ĀŒ2 x 2.5" removable SSD tray
ĀŒ1 x Externally accessible SD card socket with cover
ĀŒ1 x Reset button
ĀŒ1 x Power button
ĀŒ1 x USB 3.0 type A (5V/0.9A)
ĀŒ2 x HDMI 1.4b
ĀŒ1 x Mic-in, 1 x Line-out


I/O Interface-Rear
ĀŒ1 x 3-pin terminal block for 9V~48V DC
ĀŒ1 x RJ45 10/100/1000 Mbps
ĀŒ4 x PoE 802.3af/at (max. 60W)
ĀŒ1 x VGA
ĀŒ1 x DB9 full RS-232
ĀŒ4 x SMA antenna
ĀŒ2 x USB 2.0 type A (5V/0.5A)
ĀŒ1 x Line-out
ĀŒ1 x DB15 (DIO)
- 4 x DI with isolation
- 4 x DO with isolation
- Vin, GND for GPIO
ĀŒ1 x DB15 (MULTI PORT)
- 1 x RS422/RS485
- 1 x RS232 (TX/RX)
- 1 x CAN 2.0B
- 1 x 12VDC, 2A output (Vout, GND)


Power Management
ĀŒPower input 9~48 VDC
ĀŒSelectable boot-up & shut-down voltage for low power protection by software
ĀŒSetting 8-level power on/off delay time by software
ĀŒSupport S3/S4 suspend mode
ĀŒ10~255 seconds WDT support, setup by software
ĀŒSDK (Windows/Linux) including utility and sample code


Operating System
ĀŒDebian Linux and other variants


Dimensions
ĀŒ260mm (W) x 196mm (D) x 66.5mm (H)


Weight
ĀŒ3.2kg


Environment
ĀŒOperating temperatures: -20Ā°C~60Ā°C (w/ Google Edge TPU & industrial SSD) with air flow
ĀŒStorage temperatures: -40Ā°C to 80Ā°C
ĀŒRelative humidity: 10% to 90% (non-condensing)
ĀŒVibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common
carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum
integrity test
ĀŒShock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional
shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash
hazard shock test=75g


Standards/Certifications
ĀŒ CE
ĀŒ FCC Class A
ĀŒ E13 mark